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Adhesive Purpose

DS-LM-100/1700K for 2 substrates

Specifications :

Item	Unit	DS-LM-100/1700K	Specification are subject to change without notice; above for reference only, the up-date data please refer to quotation specified. Thickness of substrate should meet general requirement. Customized model available and upon request.
Extruder / T-Die	pcs	1/1
Screw Diameter (L/D)	mm	100 (32/1)
T Die Width	mm	1700
Product Width	mm	1100-1500
Unwinder	pc	2
Package Size	mm	Ø1000 x W1650
Lamination Speed	mm/min	20-100
Lamination Thickness	um	15-100
Tension Control	unit	2
Rewinder	pcs	1
Main power	hp	50
Layout Space L x W x H	m	15.22 x 9.0 x 2.7

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